Electrical discharge machining of micro holes on titanium sheets: effect of process parameters and electrode shape
Conference Paper
Publication Date:
2011
Short description:
(2011). Electrical discharge machining of micro holes on titanium sheets: effect of process parameters and electrode shape [conference presentation - intervento a convegno]. Retrieved from http://hdl.handle.net/10446/25616
abstract:
Micro-Electrical Discharge Machining (μEDM) has become a widely accepted non-traditional material removal process for micro-manufacture of conductive materials considered difficult to be cut using traditional machining technologies. Moreover, EDM is an ideal process for obtaining burr-free micron-size apertures with high aspect ratios. Aim of this work was to investigate the feasibility of drilling micro holes on titanium using μ-EDM technology. Titanium plates having a thickness equal to 0.5 mm were taken into account and the holes were performed using a carbide electrode having a diameter equal to 0.3 mm. The Design Of Experiment (DOE) method was used for planning the experimental campaign and ANOVA techniques were applied to study the relationship between process parameters and final output. In particular, the most important process parameters such as peak current, pulse duration, frequency and electrode rotation speed were investigated as a function of material removal rate, wear rate and machining accuracy. Geometrical and dimensional analyses were carried out on micro-holes using both optical and scanning electron microscopes to evaluate both the over cut and the rate of taper.
Iris type:
1.4.01 Contributi in atti di convegno - Conference presentations
List of contributors:
D'Urso, Gianluca Danilo; Longo, Michela; Maccarini, Giancarlo; Ravasio, Chiara
Book title:
ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference
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