A preliminary study of new interaction devices to enhance virtual socket design
Contributo in Atti di convegno
Data di Pubblicazione:
2014
Citazione:
(2014). A preliminary study of new interaction devices to enhance virtual socket design [conference presentation - intervento a convegno]. Retrieved from http://hdl.handle.net/10446/31116
Abstract:
This paper presents a research work on the augmented interaction applied to an innovative platform to design lower
limb prosthesis, in particular the prosthetic socket. The underlining idea is to experiment low-cost hand-tracking devices, to manipulate the 3D virtual model of the socket using hands as traditional done by the prosthetist. The goal is to make
available a modeling tool, named Socket Modeling Assistant SMA
that permits to replicate/emulate manual operations usually performed by the prosthetist during the traditional
development process. Two devices have been considered and compared: the Leap Motion device and the Intel Gestures
Camera. To this end a set of gestures has been identified to make more natural the interaction with SMA. Preliminary tests and results reached so are described and discussed.
limb prosthesis, in particular the prosthetic socket. The underlining idea is to experiment low-cost hand-tracking devices, to manipulate the 3D virtual model of the socket using hands as traditional done by the prosthetist. The goal is to make
available a modeling tool, named Socket Modeling Assistant SMA
that permits to replicate/emulate manual operations usually performed by the prosthetist during the traditional
development process. Two devices have been considered and compared: the Leap Motion device and the Intel Gestures
Camera. To this end a set of gestures has been identified to make more natural the interaction with SMA. Preliminary tests and results reached so are described and discussed.
Tipologia CRIS:
1.4.01 Contributi in atti di convegno - Conference presentations
Elenco autori:
Colombo, Giancarlo; Facoetti, Giancarlo; Rizzi, Caterina; Vitali, Andrea
Link alla scheda completa:
Titolo del libro:
Proceedings of the ASME 2014 International Design Engineering Technical Conferences &
Computers and Information in Engineering Conference: IDETC/CIE 2014: August 17-20, 2014, Buffalo, New York, USA
Computers and Information in Engineering Conference: IDETC/CIE 2014: August 17-20, 2014, Buffalo, New York, USA