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  1. Pubblicazioni

Ti Surface Laser Polishing: Effect of Laser Path and Assist Gas

Contributo in Atti di convegno
Data di Pubblicazione:
2015
Citazione:
(2015). Ti Surface Laser Polishing: Effect of Laser Path and Assist Gas [conference presentation - intervento a convegno]. Retrieved from http://hdl.handle.net/10446/50310
Abstract:
Laser polishing is a process by which the surface roughness of machined parts can be reduced avoiding ablation phenomena. In this process the laser spot irradiates the sample surface with short laser pulses at a power density that causes a surface melting of the order of few nanometers. Compared to conventional polishing process (as grinding) it ensures the possibility of avoiding any surface orientation, no tool wear, no abrasive or liquids, no debris and less machining time; moreover coupled with a galvo system it results to be more suitable in case of 3D complex workpieces. Nowadays, on this process, several authors are focusing their attention on the wavelength and pulse length effect but a lack of knowledge concerning the effect of other process parameters still exists. In this work the effects of laser path and assist gas were tested by the authors. Nd:YVO4 laser source, characterized by a wavelength equal to 532 nm, was used in the experiments and Ti grade 2 samples were selected. A full experimental plan was designed to investigate the influence of process parameters in terms of average roughness reduction achieved.
Tipologia CRIS:
1.4.01 Contributi in atti di convegno - Conference presentations
Elenco autori:
Giorleo, Luca; Ceretti, Elisabetta; Giardini, Claudio
Autori di Ateneo:
GIARDINI Claudio
Link alla scheda completa:
https://aisberg.unibg.it/handle/10446/50310
Link al Full Text:
https://aisberg.unibg.it/retrieve/handle/10446/50310/61521/[CI-127]%20-%20Ti%20surface%20laser%20polishing%20effect%20of%20laser%20path%20and%20assist%20gas.pdf
Titolo del libro:
9th CIRP Conference on Intelligent Computation in Manufacturing Engineering - CIRP ICME '14
Pubblicato in:
PROCEDIA CIRP
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