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First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×10(16) neq cm−2

Academic Article
Publication Date:
2019
Short description:
(2019). First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×10(16) neq cm−2 [journal article - articolo]. In JOURNAL OF INSTRUMENTATION. Retrieved from http://hdl.handle.net/10446/159421
abstract:
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm-2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.
Iris type:
1.1.01 Articoli/Saggi in rivista - Journal Articles/Essays
List of contributors:
Meschini, M.; Ceccarelli, R.; Dinardo, M.; Gennai, S.; Moroni, L.; Zuolo, D.; Demaria, L.; Monteil, E.; Gaioni, Luigi; Messineo, A.; Curras, E.; Duarte, J.; Fernandez, M.; Gomez, G.; Garcia, A.; Gonzalez, J.; Silva, E.; Vila, I.; Betta, G. F. D.; Mendicino, R.; Boscardin, M.
Authors of the University:
GAIONI Luigi
Handle:
https://aisberg.unibg.it/handle/10446/159421
Published in:
JOURNAL OF INSTRUMENTATION
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Settore ING-INF/01 - Elettronica
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