Recent results and plans of the 3D IC consortium

Vertical integration technologies are very promising in view of the demanding requirements set by the future High Energy Physics (HEP) experiments at particle accelerators. In these applications silicon pixel sensors will be required to integrate advanced functionalities and to have low mass and small pitch. This paper presents the activities of the 3D IC consortium and describes the designs submitted in the first multi-project (MPW) run taking advantage of a homogeneous vertical integration technology.